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TFE-1-A1
Conductivity / TDS Probes

TFE-1-A1

Compact Planar Ring-electrode Probe

Compact planar electrode assembly for embedded conductivity and TDS product designs.

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Key Specifications
Interface
Electrode and temperature leads
Supply
Host circuit dependent
Measurement Range
EC / TDS application dependent

Product capabilities

Evaluate the capabilities that matter in your system

A compact gold-plated copper planar probe using food-grade nylon/PP and an integrated NTC. It is designed for direct incorporation into conductivity and TDS appliances.

01

Planar ring-electrode geometry

Gold-plated copper electrode with food-grade nylon/PP structure.

02

Integrated temperature sensing

Integrated 10 kΩ ±1% NTC, B value 3435.

03

Smooth, easy-clean surface

Specified working temperature 0–60 °C.

04

Suitable for direct product integration

Range and accuracy depend on the selected interface ASIC and completed product calibration.

Overview

Product overview

A compact gold-plated copper planar probe using food-grade nylon/PP and an integrated NTC. It is designed for direct incorporation into conductivity and TDS appliances.

Compact planar electrode assembly for embedded conductivity and TDS product designs. • Planar ring-electrode geometry • Integrated temperature sensing • Smooth, easy-clean surface • Suitable for direct product integration • Supports insert-molded structures

Engineering notes

Selection and system integration

  1. 01Gold-plated copper electrode with food-grade nylon/PP structure.
  2. 02Integrated 10 kΩ ±1% NTC, B value 3435.
  3. 03Specified working temperature 0–60 °C.
  4. 04Range and accuracy depend on the selected interface ASIC and completed product calibration.

Technical data

Key Specifications

Use this information for initial selection; confirm final design and purchasing against the current approved datasheet and sample.

Interface
Electrode and temperature leads
Supply
Host circuit dependent
Measurement Range
EC / TDS application dependent
Accuracy
Electrode and circuit dependent
Temperature
Integrated temperature sensor

Application readiness

Installation, calibration and validation

Validate the product with real samples, final mechanics and the intended electrical environment before production.

  1. 01

    Do not exceed the specified working temperature or expose the plated electrode to incompatible cleaners.

  2. 02

    Match the host NTC circuit to 10 kΩ / B3435.

  3. 03

    Perform calibration after final assembly and sealing.

Public documents

Datasheets and product documents

Documents are based on AtomBit public product information; confirm the current revision before design release.

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